TEMSCON Global 2025 is the flagship conference for the IEEE Technology and Engineering Management Society, bringing together researchers, practitioners, policy experts, students, and others to present and discuss new developments in management, innovation, and leadership across the spectrum of technology, science, and engineering.

Full papers and extended abstracts that are accepted and presented at the conference will be submitted for inclusion in the IEEE Xplore digital library and indexed by EI/Compendex, Scopus, and other databases.

Special Issues of TEMS Publications
Authors of selected full papers will be invited to submit extended versions of their manuscripts for special issues of IEEE Transactions on Engineering Management and IEEE Engineering Management Review. We will also feature selected presentations in the TEMS Leadership Briefs.

Workshops and Special Sessions
TEMSCON Global 2025 will feature several preconference workshops, to be held August 4, and special sessions, to be held August 5 – 7. Proposals for these are also welcome.

Submission instructions can be found under the Author tab

Submission
Deadline
March 20, 2025

Special Session Submission
April 1, 2025

Workshop Submission
April 15, 2025

Acceptance/Rejection Notice
April 30, 2025

Final Manuscript Submission
June 1, 2025