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Submission Instructions",{"id":130,"description":837,"showPageHeader":8,"backgroundColor":49,"image":16},"Submit your cutting-edge research as a full paper or extended abstract to TEMSCON Global 2025 to showcase innovation and impact to an international audience.",[839,856,861,867,876,884,891,897],{"id":840,"__component":841,"componentVariation":842,"styles":16,"header":843,"body":846},72,"content.content","Content Image Left",{"id":790,"heading":844,"prose":44,"lead":16,"eyebrow":16,"badge":16,"componentVariation":845,"containerWidth":16,"image":16},"Author Instructions","Heading Center",{"id":847,"title":16,"body":848,"containerWidth":16,"buttonGroup":849,"media":16},92,"\u003Cp style=\"text-align:justify;\">TEMSCON Global is pleased to offer researchers, students, and practitioners a rapid-review opportunity for inclusion of their updated and late-breaking contributions to the conference. Accepted and presented papers and extended abstracts will be included in the conference proceedings and submitted to IEEE Xplore and relevant databases. These second-round manuscripts will be reviewed according to the same guidelines and criteria as first-round submissions.\u003C/p>\u003Cp style=\"text-align:justify;\">The following deadlines will be strictly enforced:\u003C/p>\u003Cul>\u003Cli style=\"text-align:justify;\">All contributions must be submitted by July 2, 2025.\u003C/li>\u003Cli style=\"text-align:justify;\">Acceptance/rejection decisions will be communicated by July 13, 2025\u003C/li>\u003Cli style=\"text-align:justify;\">Final papers must be uploaded by July 20, 2025\u003C/li>\u003C/ul>\u003Cp style=\"text-align:justify;\">Note that second-round submissions will not be eligible for Best Paper and Best Student Paper awards. \u003C/p>\u003Cp style=\"text-align:justify;\">For questions, contact Alexis Wisdom at \u003Ca href=\"mailto:awisdom@conferencecatalysts.com\">awisdom@conferencecatalysts.com\u003C/a>.\u003C/p>",{"id":828,"variation":850,"button":851},"Buttons Center",[852],{"id":551,"label":853,"size":642,"color":854,"style":16,"icon":644,"iconPosition":645,"url":855,"newWindow":8,"downloadable":16,"shape":16},"Submit to EDAS Now!","btn-secondary","https://edas.info/N33106",{"id":857,"__component":841,"componentVariation":842,"styles":16,"header":16,"body":858},73,{"id":859,"title":16,"body":860,"containerWidth":16,"buttonGroup":16,"media":16},93,"\u003Cp style=\"text-align:justify;\">The conference welcomes submissions of both extended abstracts and full papers, for presentation at the conference and publication in the conference proceedings. \u003C/p>\u003Cp style=\"text-align:justify;\">\u003Cstrong>A submission implies a willingness to register and present the work if the paper is accepted for presentation at the conference. Manuscripts will be reviewed by the Technical Program Committee. Authors of accepted full papers and extended abstracts must submit the final version according to the deadline, register for the conference, and attend to present their work.\u003C/strong>\u003C/p>\u003Cp style=\"text-align:justify;\">**Full papers and extended abstracts that are accepted and presented will be submitted for inclusion in the IEEE Xplore digital library and for indexing by EI/Compendex, Scopus, Web of Science, and other databases. For more details see \u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://journals.ieeeauthorcenter.ieee.org/when-your-article-is-published/abstracting-indexing-ai-databases/\">here\u003C/a>. \u003C/p>\u003Cp style=\"text-align:justify;\">Authors of selected full papers will be invited to submit revised and enhanced manuscripts for potential publication in special issues of \u003Ci>IEEE Transactions on Engineering Management\u003C/i> and \u003Ci>IEEE Engineering Management Review\u003C/i>. \u003C/p>",{"id":862,"__component":841,"componentVariation":842,"styles":16,"header":16,"body":863},74,{"id":864,"title":865,"body":866,"containerWidth":16,"buttonGroup":16,"media":16},94,"Submission Guidelines","\u003Cul>\u003Cli style=\"text-align:justify;\">\u003Cstrong>Full Papers:\u003C/strong> The maximum length for full-paper submissions is six (6) pages. Papers should include a complete description of the proposed technical content and research results and explain the significance and originality of the contribution. All submissions should be within the scope of the conference, well-structured, and written in clear English. References to the relevant literature should be included.\u003Cul>\u003Cli style=\"text-align:justify;\">Up to 2 additional pages can be purchased, for a maximum of 8 pages, at $100 each\u003C/li>\u003C/ul>\u003C/li>\u003Cli style=\"text-align:justify;\">\u003Cstrong>Extended Abstracts: \u003C/strong>The maximum length for extended abstracts is two (2) pages. Extended abstracts are intended for summary presentations of new concepts or ideas and for presentations of promising in-progress research. All submissions should be within the scope of the conference, well-structured, and written in clear English. Selected references to the relevant literature should be included.\u003Cul>\u003Cli style=\"text-align:justify;\">Up to 1 additional page can be added, for a maximum of 3 pages\u003C/li>\u003C/ul>\u003C/li>\u003Cli style=\"text-align:justify;\">\u003Cstrong>Paper Preparation: \u003C/strong>Manuscripts must adhere to the paper preparation guidelines provided below. Deviations from these guidelines may lead to the immediate rejection of your paper by the system.\u003C/li>\u003Cli style=\"text-align:justify;\">\u003Cstrong>Paper Revisions: \u003C/strong>In case of minor revision, papers are accepted only upon the condition that the changes requested by the Reviewers are satisfactorily addressed by the Authors in the final submitted papers. Final papers may be rejected if the Reviewers' remarks have not been properly addressed.\u003C/li>\u003Cli style=\"text-align:justify;\">\u003Cstrong>Willingness to Present: \u003C/strong>Submission of a paper or extended abstract indicates your willingness to register and present the work, should it be accepted, for on-site presentation at the TEMSCON Global 2025 conference.\u003C/li>\u003Cli style=\"text-align:justify;\">\u003Cstrong>Use of AI:\u003C/strong> \u003Cspan style=\"background-color:rgb(255,255,255);color:rgb(48,48,48);\">The use of artificial intelligence (AI)–generated text in an article shall be disclosed in the acknowledgements section of any paper submitted to an IEEE Conference or Periodical. The sections of the paper that use AI-generated text shall have a citation to the AI system used to generate the text.\u003C/span>\u003C/li>\u003C/ul>",{"id":868,"__component":841,"componentVariation":842,"styles":869,"header":16,"body":872},75,{"id":870,"edgeTop":48,"edgeBottom":48,"background":871,"containerWidth":16},50,"base-50",{"id":873,"title":874,"body":875,"containerWidth":16,"buttonGroup":16,"media":16},95,"Paper Preparation","\u003Cp style=\"margin-left:0px;text-align:justify;\">\u003Ci>For your convenience, the Style Manual and Conference Paper templates in various formats are available through the following links: \u003C/i>\u003C/p>\u003Cul>\u003Cli style=\"text-align:justify;\">\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://www.ieee.org/conferences_events/conferences/publishing/templates.html\">\u003Cstrong>\u003Cu>Style Manual\u003C/u>\u003C/strong>\u003C/a>\u003Cstrong> \u003C/strong> \u003C/li>\u003Cli style=\"text-align:justify;\">\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://www.ieee.org/conferences_events/conferences/publishing/templates.html\">\u003Cstrong>\u003Cu>Paper Template\u003C/u>\u003C/strong>\u003C/a> \u003C/li>\u003C/ul>\u003Cp style=\"margin-left:0px;text-align:justify;\">Both full paper and extended abstract submissions are required to utilize this template. Submissions will be fully reviewed, with the final decision made by the Technical Program Committee.  \u003Cbr>\u003Cbr>All accepted papers and extended abstracts presented at the conference will be submitted for publication to IEEE Xplore. \u003Cstrong>Using the IEEE template is mandatory, and any variation from the IEEE template may lead to immediate rejection of your paper by the system.\u003C/strong>\u003C/p>",{"id":877,"__component":841,"componentVariation":842,"styles":878,"header":16,"body":880},76,{"id":262,"edgeTop":48,"edgeBottom":48,"background":879,"containerWidth":16},"transparent",{"id":881,"title":882,"body":883,"containerWidth":16,"buttonGroup":16,"media":16},96,"Author Registration","\u003Cp style=\"text-align:justify;\">Each lead author must visit the EDAS website and establish an account with a username and password.\u003C/p>\u003Col style=\"list-style-type:decimal;\">\u003Cli style=\"text-align:justify;\">Visit the \u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://edas.info/N33106\">TEMSCON Global 2025\u003C/a> Submission Portal and click the link to create a new account, if you do not already have an account. If you have an account, log in to EDAS and follow the Submission of Full Paper instructions below.\u003C/li>\u003Cli style=\"text-align:justify;\">Create your profile. Only the five fields with the red asterisk are required. *It is very important that your name and affiliation associated with your EDAS account are correct and match the name and affiliation that will be listed on your paper. These fields are first & last name, affiliation (company or organization), country, e-mail address, and status. When the fields are filled in, check the Privacy Policies box and click the Add Person button.    [note: if you select the USA as the country, you will get a message asking for your state]\u003C/li>\u003Cli style=\"text-align:justify;\">You will receive an e-mail containing your password. Your email address and the given password must later be used to access the system during the following steps, so be careful to remember them.\u003C/li>\u003Cli style=\"text-align:justify;\">You can then return to the EDAS log-in page \u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://edas.info/login.php?rurl=aHR0cHM6Ly9lZGFzLmluZm8vbmV3UGFwZXIucGhwP2M9MzE0MTA=\">(http://www.edas.info)\u003C/a> and change your assigned password to one that is easier to remember. To do this, click on the My Profile tab, and then click on change your password. Be sure to record your username, password, and ID number for later reference.\u003C/li>\u003C/ol>",{"id":885,"__component":841,"componentVariation":842,"styles":886,"header":16,"body":887},77,{"id":793,"edgeTop":48,"edgeBottom":48,"background":871,"containerWidth":16},{"id":888,"title":889,"body":890,"containerWidth":16,"buttonGroup":16,"media":16},97,"Submission of Full Paper or Extended Abstract","\u003Cp style=\"text-align:justify;\">Please log in at \u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"http://www.edas.info\">http://www.edas.info\u003C/a> and follow these steps:\u003C/p>\u003Col style=\"list-style-type:decimal;\">\u003Cli style=\"text-align:justify;\">Click here to be taken to the \u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://edas.info/N33106\">TEMSCON Global 2025\u003C/a> Submission Portal.\u003C/li>\u003Cli style=\"text-align:justify;\">Select the post-deadline track your submission falls under - Full Paper or Extended Abstract\u003C/li>\u003Cli style=\"text-align:justify;\">Type your paper title and complete all other fields\u003C/li>\u003Cli style=\"text-align:justify;\">Click the Register Paper button.\u003C/li>\u003Cli style=\"text-align:justify;\">On the next page you will see a large green check mark and a statement that the paper was recorded.\u003C/li>\u003Cli style=\"text-align:justify;\">The last row says Review Manuscript or Review Abstract and has an icon of a cloud under it. Click on this icon, and then you can upload the PDF of your Full Paper on the next page. \u003C/li>\u003C/ol>\u003Cp style=\"text-align:justify;\">“Manuscript” is used to refer to the PDF form of your initial submission. You can also upload the paper by clicking the My Papers tab at the top of the screen, and then selecting the upload icon on the same row as the name of your paper. The upload icon (third column from the right) will open a dialog box that will enable you to select and upload the Full Paper file via the web or via FTP.\u003C/p>",{"id":757,"__component":841,"componentVariation":842,"styles":892,"header":16,"body":893},{"id":828,"edgeTop":48,"edgeBottom":48,"background":879,"containerWidth":16},{"id":894,"title":895,"body":896,"containerWidth":16,"buttonGroup":16,"media":16},98,"IEEE Copyright Notice","\u003Cp style=\"text-align:justify;\">If authors would like to post their papers electronically on any website, any FTP site, or any other electronic dissemination technique, they must include the IEEE Copyright notice on the initial screen displaying the IEEE-copyrighted material.\u003C/p>\u003Cp style=\"margin-left:0px;text-align:justify;\">\u003Ca target=\"_blank\" rel=\"noopener noreferrer\" href=\"https://www.ieee.org/publications/rights/copyright-main.html\">\u003Ci>\u003Cstrong>\u003Cu>IEEE Copyright Form\u003C/u>\u003C/strong>\u003C/i>\u003C/a>\u003C/p>\u003Cp style=\"text-align:justify;\">Each accepted contribution to TEMSCON Global 2025 must be accompanied by a signed Copyright Form. The copyright form should be filled out and signed by one author, preferably the primary author.\u003C/p>",{"id":898,"__component":841,"componentVariation":842,"styles":899,"header":16,"body":901},79,{"id":900,"edgeTop":48,"edgeBottom":48,"background":871,"containerWidth":16},54,{"id":902,"title":903,"body":904,"containerWidth":16,"buttonGroup":16,"media":16},99,"PROBLEMS & FURTHER INFORMATION","\u003Cp>For any problem or further information, please, contact Alexis Wisdom at \u003Ca href=\"mailto:awisdom@conferencecatalysts.com\">awisdom@conferencecatalysts.com\u003C/a>.\u003C/p>",{"data":906,"meta":912},{"id":250,"heading":835,"createdAt":907,"updatedAt":908,"publishedAt":909,"url_path_id":910,"url_path":911,"contentType":79},"2025-06-16T14:04:25.154Z","2025-06-16T14:15:44.351Z","2025-06-16T14:04:42.734Z","214","/authors/second-round-submission-instructions",{},1778853713779]